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SMD prototyping adapters

Adapters permits to accomodate  wide diversity of SMD package sizes and shapes ( SO, SOIC, TSSOP, SOP, SOT23. TQFP, PLCC ) to mount using universal prototyping boards with 2.54mm hole pitch. All PCBs 1.6 mm thickness, with solder mask. Double sided PCBs with plated through-hole.

 

 


MB-SOIC-SSOP

Double side PCB  can accommodate device packages:

 

  • SOIC pin count 6-32, pin pitch 1.27mm
  • TSSOP, SSOP pin count  6-28 pin pitch 0.65mm
  • SOP, SOT23 pin count 3-8 pin pitch 0.95mm 

 

PCB dimensions: 25 x 22 mm

 

 





TSSOP-2

Double side PCB  can accommodate device packages:

 

  • SSOP pin count 6-56, pin pitch 0.635mm
  • TSSOP pin count  6-64 pin pitch 0.5mm
     

 

PCB dimensions: 43 x 30 mm

 

 





MB-QFP-1

Double side PCB  can accommodate device packages:

 

  • QFP pin count 32-64-80, pin pitch  0.8mm
  • QFP pin count 64-100, pin pitch 0.65mm
  • QFP pin count 48, pin pitch 0.5mm 

 

PCB dimensions: 41 x 48 mm.

 

 





MB-QFP-2

Double side PCB  can accommodate device packages:

 

  • QFP pin count 52, pin pitch  0.65mm
  • QFP pin count 44, pin pitch 0.8mm 

 

PCB dimensions: 28 x 28 mm.

 

 





MB-QFP-3

Single side PCB  can accommodate device packages:

 

  • LQFP/PQFP pin count 48-208, pin pitch 0.5mm  

 

PCB dimensions: 62 x 62 mm.

 

 




 

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